Thermal conductivity: 1.0-4.0w/m.k
Thickness: 0.3-12mm
UL Certificated
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| Led use Thermal Pad |
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| PCB use thermal pad |
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| Thermal pad and Heatsink |
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| Thermal Pad Applications |
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| Thermal Pad for CPU GPU DDR RAM CHIP |
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| Thermal Pad for CPU GPU DDR RAM CHIP |
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| Thermal Pad for CPU GPU DDR RAM CHIP |
Typical application:
-between the Circuit board chip and heat sink of LCD-TV
-PDP chip and IC
-between the transformer and the shell.
-between Led particle base and aluminum plate
-between PCB board and its shell
-between IC and heat sink
-laptop NB display card and network card
-between STB C and heat sink or shell
AOK(Trademark of Shenzhen Aochuan Technology Co.,Ltd http://www.aok-technologies.com/) have developed a
comprehensive range of choices for thermal interface materials which include
thermal grease, thermally conductive gap filler, thermal conductive insulators
and phase change materials, which satisfy the requirement of heat dissipation
well in an extensive variety of applications, as well as widely applied to
electromechanical, automotive, telecom and military industries.
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